Copper Foil Properties (Theoretical)
| Molecular Weight | 63.55 |
|---|---|
| Appearance | solid |
| Melting Point | 1083.4 °C |
| Boiling Point | 2567 °C |
| Density | 8.96 g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 1.678 microhm-cm @ 20 °C |
| Electronegativity | 1.9 Paulings |
| Heat of Fusion | 3.11 Cal/gm mole |
| Heat of Vaporization | 72.8 K-cal/gm atom at 2567 °C |
| Poisson’s Ratio | 0.34 |
| Specific Heat | 0.092 Cal/g/K @ 25 °C |
| Tensile Strength | N/A |
| Thermal Conductivity | 4.01 W/cm/K @ 298.2 K |
| Thermal Expansion | (25 °C) 16.5 µm·m-1·K-1 |
| Vickers Hardness | 369 MPa |
| Young’s Modulus | 110–128 GPa |
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